The nanowire
transistor uses two wrap-around metal gates to define two distinct transistors
on a single nanowire (vertical rod)
New design reduces
the areal footprint of nanowire transistors by a factor of two
Semiconductor
chip makers first began the production of three-dimensional (3D) transistors in
2011. Engineers can pack more 3D transistors onto a single chip because they
are much more compact than traditional transistors.
For
future generations of semiconductor chips, however, there is a need to shrink
these 3D transistors further and the use of vertical nanowires in the transistor
design is one of the promising approaches. Moreover, the area taken up by a
nanowire-based transistor is typically half that of a planar transistor — or
even less if considering more complicated components, like inverters. Xiang Li
at the A*STAR Institute of Microelectronics and co-workers1 have now integrated
two transistors onto a single vertical silicon nanowire, pushing the areal
density limit of nanowire transistors even further.
The
researchers used wrap-around gates, or ‘gate-all-around’ gates, in the making
of their device. These gates consist of a vertical cylinder, at the center of
which lies the nanowire. They are much better at controlling the transistor
current than traditional planar gates. Li and co-workers decreased the area
required for a gate-all-around nanowire transistor by a factor of two by
constructing two transistors out of a single vertical nanowire. Their design
involves two wrap-around gates, one above the other, separated by a thin
dielectric layer to isolate them electrically (see image). Unlike other
independent double-gate transistor designs, such as those employing a vertical
fin-like channel, changing the gate voltage applied to one transistor does not
change the threshold (or turn-on) voltage of the other. This means that either
of the gates can modulate the nanowire current independently.
As
a result, Li and co-workers were able to construct a simple logic device using
just one nanowire. For a nanowire doped with negative carriers, current was
able to flow when both gate voltages were high, but current stopped when either
gate voltage was low. This device therefore functioned as an ‘AND’ digital
gate, but used only half the area it otherwise would require. The stacked gate
arrangement may also be useful for enabling an emerging type of transistor,
called a tunnel field effect transistor (TFET). Because TFETs rely on the
tunneling of electrons across a barrier rather than the thermal activation of
electrons, they turn on very quickly and consume very little power. Li says the
tunnel junction required for a TFET could be formed between the two gates of
the dual-gate nanowire geometry, allowing a particularly compact
implementation. The dual-gate design could also be used for other technologies,
such as non-volatile memory.
The A*STAR-affiliated researchers contributing to this
research are from the Institute of
Microelectronics
References
- Li, X. et al. Vertically stacked and independently
controlled twin-gate MOSFETs on a single Si nanowire. IEEE
Electron Device Letters 32, 1492–1494 (2011). | article
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